ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,327, issued on Sept. 29, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.). "Stress-reduction structures for a compound semiconducto... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,328, issued on Sept. 29, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Direct hybrid bond pad having ... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,329, issued on Sept. 29, was assigned to CreeLED Inc. (Durham, N.C.). "Edge-emitting semiconductor devices and related methods" was invent... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,330, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Cha... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,331, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor chip, semiconductor device, ... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,333, issued on Sept. 29, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device" was invented by Isamu Nishimura (Kyoto, Japa... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,334, issued on Sept. 29, was assigned to Samsung Display Co. LTD. (Gyeonggi-do, South Korea). "Display apparatus and method of manufacturi... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,335, issued on Sept. 29, was assigned to MACRONIX INTERNATIONAL Co. LTD. (Hsinchu, Taiwan). "Memory device" was invented by Shih-Hung Chen... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,337, issued on Sept. 29, was assigned to Monolithic Power Systems Inc. (Kirkland, Wash.). "Double-side-cooling power module" was invented ... Read More
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,338, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Packaged integrated circuit devices with e... Read More